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#1
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Intel® Pentium® 4 - Little Black Hole on top?
Hi,
having just installed my first P4, there is something I wasn't sure of. What is that little black hole on the upper surface of the CPU?. I was worried about getting any AS/3 into it when I was applying the thermal goo. .. . thanks, -- Wayne ][ Sign on door reads: Please Do No Disturb! Pentium 4 assembly in progress! |
#2
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Wayne Youngman wrote:
Hi, having just installed my first P4, there is something I wasn't sure of. What is that little black hole on the upper surface of the CPU?. I was worried about getting any AS/3 into it when I was applying the thermal goo. . . thanks, To let the air and potentially excess goo out when they slap the lid on the package. |
#3
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"David Maynard" wrote
To let the air and potentially excess goo out when they slap the lid on the package. Hi, you got me there? care to elaborate? -- Wayne ][ Sign on door reads: Please Do No Disturb! Pentium 4 assembly in progress! |
#4
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"Wayne Youngman" wrote in message ... Hi, having just installed my first P4, there is something I wasn't sure of. What is that little black hole on the upper surface of the CPU?. I was worried about getting any AS/3 into it when I was applying the thermal goo. . . thanks, A short way down the page: http://tech-report.com/reviews/2001q1/pentium4/index3.x Quixote |
#5
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David Maynard wrote:
To let the air and potentially excess goo out when they slap the lid on the package. And to vent warp plasma? |
#6
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Underneath the cap is usually quite a large splodge of material that
Intel use for both (obvious) conductivity & adhesion to stick it on. Future caps will probably be different, using an interesting idea where standoffs are used which ironically reduces hotspots: o A heatspreader itself has to be well machined to contact the core ---- suffers the same touches-at-3-points as a heatsink to spreader o Despite this you get hotspots regularly re spreader to core o Solution is to use 4 or 9 standoffs between spreader & core ---- the standoffs have a thinner layer of adhesive than a spreader ---- gaps between the standoffs have thicker adhesive conversely Ironically it reduces hot-spots quite considerably, beyond 9 standoffs the benefit deteriorates rapidly as you tend towards a heatspreader. It's a cheaper solution than another alternative to hotspots solved by "wasting" silicon space. For example hot areas in the middle of a die can conduct heat thro the substrate in 4 directions, those hot areas on the edge can only conduct in 2 directions - a solution posted is to use bare silicon (eg, 1mm) to drastically mitigate the W/mm^2 problem. Sounds easy, but on a wafer you're wasting real-estate and so the standoff solution might be engineered with the die thermal profile. So in the future that heatspreader may get even more important. -- Dorothy Bradbury |
#7
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See, it's like building a ship in a bottle. First you get the CPU package,
then you assemble the transistors and conductors with tiny tweezers through the hole. That's why going to smaller feature sizes make CPU's cheaper! -- Phil Weldon, pweldonatmindjumpdotcom For communication, replace "at" with the 'at sign' replace "mindjump" with "mindspring." replace "dot" with "." "Wayne Youngman" wrote in message ... Hi, having just installed my first P4, there is something I wasn't sure of. What is that little black hole on the upper surface of the CPU?. I was worried about getting any AS/3 into it when I was applying the thermal goo. . . thanks, -- Wayne ][ Sign on door reads: Please Do No Disturb! Pentium 4 assembly in progress! |
#8
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Intel puts it there to let the smoke out ;-0
-- Tally Ho! Ed, Maryland, USA "Wayne Youngman" wrote in message ... Hi, having just installed my first P4, there is something I wasn't sure of. What is that little black hole on the upper surface of the CPU?. I was worried about getting any AS/3 into it when I was applying the thermal goo. . . thanks, -- Wayne ][ Sign on door reads: Please Do No Disturb! Pentium 4 assembly in progress! |
#9
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Fishface wrote:
David Maynard wrote: To let the air and potentially excess goo out when they slap the lid on the package. And to vent warp plasma? Of course. And a dern good thing too because there aren't many things worse than warp plasma buildup under your heat spreader. |
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