IBM combines SOI & strained silicon

IBM Microelectronics has announced that they've found a way to combine
two different manufacturing techniques, silicon-on-insulator and
strained silicon, together into a single complementary process called
SSDOI (strained silicon directly on insulator).

They also announced a second technique for improving electron
mobility, which they call HOT (hybrid orientation technique).

They expect the two manufacturing technologies together to give them a
65% improvement in performance.

http://www.theregister.co.uk/content/3/32722.html

Yousuf Khan

YK:

Stretched? Strained? Enough already, YK. We've been there - we've done
that. S*O*I* in fact! Tech razz ranks right-up-there to flakking
burgers at Wendys. Surf's up. What gent wouldn't prefer leisurely
chatting with some smooth_talking brunette hottie behind the bank teller
window, than pushing a faster ATM button?

Yawn. Where's my 6502 when I really need it?

ray hartman
****************

Yousuf Khan wrote:

IBM Microelectronics has announced that they've found a way to combine
two different manufacturing techniques, silicon-on-insulator and
strained silicon, together into a single complementary process called
SSDOI (strained silicon directly on insulator).

They also announced a second technique for improving electron
mobility, which they call HOT (hybrid orientation technique).

They expect the two manufacturing technologies together to give them a
65% improvement in performance.

http://www.theregister.co.uk/content/3/32722.html

Yousuf Khan