If this is your first visit, be sure to check out the FAQ by clicking the link above. You may have to register before you can post: click the register link above to proceed. To start viewing messages, select the forum that you want to visit from the selection below. |
|
|
|
Thread Tools | Display Modes |
|
#1
|
|||
|
|||
paste or pad
I need to re-attach the heatsink to my processor, should I use a thermal pad
or paste? What are the pros / cons? |
#2
|
|||
|
|||
"Max Coppin" wrote in message news:0uBkc.449$Af6.97@newsfe1-win... I need to re-attach the heatsink to my processor, should I use a thermal pad or paste? What are the pros / cons? paste period end of discussion. pads are only good for... well, never mind... ;-) YMMV |
#3
|
|||
|
|||
Max Coppin wrote:
I need to re-attach the heatsink to my processor, should I use a thermal pad or paste? What are the pros / cons? Paste runs cooler, pads are easy for a dumbass to install i.e. stick one to the bottom of the supplied HS and the end user can't forget to install it. -- Stacey |
#4
|
|||
|
|||
Stacey wrote:
Max Coppin wrote: I need to re-attach the heatsink to my processor, should I use a thermal pad or paste? What are the pros / cons? Paste runs cooler, pads are easy for a dumbass to install i.e. stick one to the bottom of the supplied HS and the end user can't forget to install it. It's also less messy, more rugged, reliably repeatable, and readily machine applied in mass production. Mention using thermal compound in most modern assembly facilities and you're likely to be run out of the place on a rail. |
#5
|
|||
|
|||
"David Maynard" wrote in message ... Stacey wrote: Max Coppin wrote: I need to re-attach the heatsink to my processor, should I use a thermal pad or paste? What are the pros / cons? Paste runs cooler, pads are easy for a dumbass to install i.e. stick one to the bottom of the supplied HS and the end user can't forget to install it. It's also less messy, more rugged, reliably repeatable, and readily machine applied in mass production. Mention using thermal compound in most modern assembly facilities and you're likely to be run out of the place on a rail. Right pads lend themselves nicely to mass production. (more rugged? i've never been able to break that paste!) But is it better for the purpose of heat transmission? |
#6
|
|||
|
|||
snoopy wrote:
"David Maynard" wrote in message ... Stacey wrote: Max Coppin wrote: I need to re-attach the heatsink to my processor, should I use a thermal pad or paste? What are the pros / cons? Paste runs cooler, pads are easy for a dumbass to install i.e. stick one to the bottom of the supplied HS and the end user can't forget to install it. It's also less messy, more rugged, reliably repeatable, and readily machine applied in mass production. Mention using thermal compound in most modern assembly facilities and you're likely to be run out of the place on a rail. Right pads lend themselves nicely to mass production. (more rugged? i've never been able to break that paste!) To 'break' it is to do something that causes it to not serve the purpose and thermal compound that gets smeared off during handling, as one example, or wasn't applied properly in the first place, doesn't do its job. It's function is 'broke'. But is it better for the purpose of heat transmission? Depends on how you define 'better'. If you mean what is the best that can be achieved under ideal conditions, and ignoring long term effects, then thermal compound is probably 'better'. If you mean being able to count on all of the applications, and the devices it's applied to, working properly without costly failures/rework then a pad is better. |
#7
|
|||
|
|||
But is it better for the purpose of heat transmission? At 40C the pad turns to paste, so it is a non issue. 99% of all the talk about paste being better is just hype. The best improvement I've ever seen using paste over a pad is 2C. Hardly even worth the effort. BTW a pad has never shorted out a CPU but paste does all the time. That's why AMD doesn't want anyone using paste and if they find out you did your 3 year warrany is void. |
#8
|
|||
|
|||
On Sat, 01 May 2004 09:05:24 GMT, Andrew J
wrote: But is it better for the purpose of heat transmission? At 40C the pad turns to paste, so it is a non issue. 99% of all the talk about paste being better is just hype. The best improvement I've ever seen using paste over a pad is 2C. Hardly even worth the effort. BTW a pad has never shorted out a CPU but paste does all the time. That's why AMD doesn't want anyone using paste and if they find out you did your 3 year warrany is void. arctic silver ceramique. not conductive. not capacitive. |
#9
|
|||
|
|||
Andrew J wrote:
But is it better for the purpose of heat transmission? At 40C the pad turns to paste, so it is a non issue. Except it's thicker, adds another layer between the CPU and heat sink. 99% of all the talk about paste being better is just hype. The best improvement I've ever seen using paste over a pad is 2C. I've seen 6-8C Hardly even worth the effort. BTW a pad has never shorted out a CPU but paste does all the time. ?? Normal silcone HSG isn't conductive so that would be pretty tough! -- Stacey |
#10
|
|||
|
|||
In article , David Maynard
wrote: Stacey wrote: Max Coppin wrote: I need to re-attach the heatsink to my processor, should I use a thermal pad or paste? What are the pros / cons? Paste runs cooler, pads are easy for a dumbass to install i.e. stick one to the bottom of the supplied HS and the end user can't forget to install it. It's also less messy, more rugged, reliably repeatable, and readily machine applied in mass production. Mention using thermal compound in most modern assembly facilities and you're likely to be run out of the place on a rail. That is because engineers in mass production situations, want what they hope will be a zero maintenance solution. Paste/grease needs to be reapplied regularly, any time a rising CPU temp suggests the paste/grease is no longer filling the gap between CPU and HSF. Thermal "pumping" or drying degrade just about any paste/grease, so at some point, the CPU/HSF interface has to be redone. There are some "gooey" solutions (look like silicon rubber) that can be injected into a heatsink assembly, using an injection port and an observation port, but the performance of that kind of solution is worse than a pad. For an Athlon, the combination of a bare die (i.e. limited contact area) and high power dissipation, really limit what will work to keep the processor cool. While AMD doesn't approve of AS3, home builders find it works just fine. (You may want to read up on AMD warranty issues if you use AS3 or something similar. If returning a processor, make sure the processor is cleaned first. Don't be sloppy with the paste/grease.) Paul |
|
Thread Tools | |
Display Modes | |
|
|
Similar Threads | ||||
Thread | Thread Starter | Forum | Replies | Last Post |
CPU Fan Paste Question | [email protected] | General | 2 | January 11th 05 07:01 AM |
To paste or not to paste after already pasting | Bf | General | 4 | March 18th 04 01:24 AM |
OCZ Ultra II thermal paste recall | FelixC | Overclocking | 2 | February 17th 04 04:52 PM |
Thermal paste | - | General | 12 | November 15th 03 08:54 AM |
Thermal pad or Thermal paste? | Vin | General | 68 | September 17th 03 05:38 AM |