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#31
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Yousuf Khan wrote:
On 10/23/2018 1:45 PM, VanguardLH wrote: You're obviously making guesses. Demand hasn't gone up despite all the news pundits saying otherwise. "Apparently" is another guess. We all are, as Intel obviously won't tell us. Anything you or I say will just be guesses. No point in mentioning it even, as it's assumed. But we all have our years of experience to draw on, and our guesses can be somewhat accurate. Intel is having to produce six- and eight-core processors when it's used to producing only quad-core maximum. It produced a lot of good dies of quad-core, but a hex- or octa-core will have larger dies, and that would make the number of good dies lower. A die that is twice as big will result in an overall 75%-80% decrease in the number dies per wafer. That includes wasted space along the sides of the wafer. Whereas AMD is just continuing to produce quad-core dies all day long, and if it wants an octa-core, it just gives you two of them! Yousuf Khan I think the Ryzen is a single die with two CCX on it. So your yield is for an 8 core chips. https://wccftech.com/amd-zeppelin-so...4-cores-rumor/ Paul |
#32
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On 10/24/2018 4:39 AM, Paul wrote:
I think the Ryzen is a single die with two CCX on it. So your yield is for an 8 core chips. https://wccftech.com/amd-zeppelin-so...4-cores-rumor/ Paul The CCX's are separate dies. That's why AMD is able to produce so many of them for cheaply. In fact, it's given AMD a real advantage over Intel, as Intel can't easily produce multi-chip modules yet. It needs a major design overhaul to achieve that. AMD probably already took the pain during the Bulldozer years, ironed out all of the necessary steps to produce MCM modules. Even though Bulldozer weren't MCM's, they had a lot of features similar to MCM's. Yousuf Khan |
#33
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Yousuf Khan wrote:
On 10/24/2018 4:39 AM, Paul wrote: I think the Ryzen is a single die with two CCX on it. So your yield is for an 8 core chips. https://wccftech.com/amd-zeppelin-so...4-cores-rumor/ Paul The CCX's are separate dies. That's why AMD is able to produce so many of them for cheaply. In fact, it's given AMD a real advantage over Intel, as Intel can't easily produce multi-chip modules yet. It needs a major design overhaul to achieve that. AMD probably already took the pain during the Bulldozer years, ironed out all of the necessary steps to produce MCM modules. Even though Bulldozer weren't MCM's, they had a lot of features similar to MCM's. Yousuf Khan Looks like one silicon die to me. There are two IP blocks on it. http://i.imgur.com/9TIpxDY.jpg On the mobile part, there is one IP block (4 cores/8 threads) https://tablet-news.com/wp-content/u...l-page-037.jpg https://www.anandtech.com/show/11964...nd-updated-zen "While Ryzen, Threadripper, and EPYC have used the 8-core Zeppelin building block for their products, the laptop side of the equation will combine the new high-performance Zen core with the latest Vega graphics in a single piece of silicon. Quad-Core with SMT Vega 10 - 10 CUs (640 SPs) " Die shot of the mobile part, with one CCX on the left, GPU on the right. https://images.anandtech.com/doci/11...52_678x452.jpg HTH, Paul |
#34
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On 11/13/2018 6:16 PM, Paul wrote:
Looks like one silicon die to me. There are two IP blocks on it. http://i.imgur.com/9TIpxDY.jpg On the mobile part, there is one IP block (4 cores/8 threads) https://tablet-news.com/wp-content/u...l-page-037.jpg https://www.anandtech.com/show/11964...nd-updated-zen "While Ryzen, Threadripper, and EPYC have used the 8-core Zeppelin building block for their products, the laptop side of the equation will combine the new high-performance Zen core with the latest Vega graphics in a single piece of silicon. Quad-Core with SMT Vega 10 - 10 CUs (640 SPs) " Die shot of the mobile part, with one CCX on the left, GPU on the right. https://images.anandtech.com/doci/11...52_678x452.jpg HTH, Paul The Ryzens use 4-core CCX's, while the Threadrippers use 8-core CCX's. Here's the Ryzen block diagram: https://www.reddit.com/r/Amd/comment..._44_33_and_22/ |
#35
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Yousuf Khan wrote:
On 11/13/2018 6:16 PM, Paul wrote: Looks like one silicon die to me. There are two IP blocks on it. http://i.imgur.com/9TIpxDY.jpg On the mobile part, there is one IP block (4 cores/8 threads) https://tablet-news.com/wp-content/u...l-page-037.jpg https://www.anandtech.com/show/11964...nd-updated-zen "While Ryzen, Threadripper, and EPYC have used the 8-core Zeppelin building block for their products, the laptop side of the equation will combine the new high-performance Zen core with the latest Vega graphics in a single piece of silicon. Quad-Core with SMT Vega 10 - 10 CUs (640 SPs) " Die shot of the mobile part, with one CCX on the left, GPU on the right. https://images.anandtech.com/doci/11...52_678x452.jpg HTH, Paul The Ryzens use 4-core CCX's, while the Threadrippers use 8-core CCX's. Here's the Ryzen block diagram: https://www.reddit.com/r/Amd/comment..._44_33_and_22/ And that's exactly what my quotes above, provide. The Ryzen product (APU flavor), uses a new die, with a 4 core CCX and a GPU. The "IP" (Intellectual Property) block size is a 4 core CCX, which is getting reused. In the Zeppelin core, two 4 core CCX IP blocks are combined on one 8 core die. The 8 core die is replicated as four dice in an Epyc. This means they're manufacturing 8 core parts on the silicon wafer. There is a grand total of two die designs. Ryzen as APU 4 core CCX + GPU on a single die --- A unique design Ryzen desktop two 4 core CCX Zepplin in a single die \ \ Threadripper two dice of the "Ryzen desktop" persuasion \ The idea two dummy dice (replaced by working dice \ is to in the next generation, dice don't have RAM / reuse connected). / the same Epyc four dice of the "Ryzen desktop" persuasion / silicon die So they are required to yield 8 core component parts. To make some of the more profitable packaged products. This diagram is an eight core silicon die. The red line, is an architectural shortcoming, not a "snip point". https://external-preview.redd.it/ynh...f106cb9 dae33 The die is one continuous thing. http://i.imgur.com/le2atYb.jpg Paul |
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